美国封装测试大厂Amkor在亚利桑那70亿美元扩建项目动工
版主: Softfist
#9 Re: 美国封装测试大厂Amkor在亚利桑那70亿美元扩建项目动工
特脑残你不能光看新闻,也要看历史。
这不是Amkor首次在亚利桑那建封装厂,第一次是在2000年左右。封装这样低利润的企业也在美国设厂,说明泡沫快破了。
#14 Re: 美国封装测试大厂Amkor在亚利桑那70亿美元扩建项目动工
主要是美韩荷的七家公司,Amkor其中之一:
Samsung: A major provider of HBM chips and a leader in 3D stacking technology
SK Hynix: Developed the first HBM memory chip and is a major player in the HBM and DRAM market
Micron: Also a significant manufacturer of HBM, with a substantial share of the market
Applied Materials: builds specialized equipment for processes like hybrid bonding and is a key player in the 3D stacking ecosystem.
Besi: A Dutch company that is a leading manufacturer of hybrid bonding equipment for mass production
Lam Research: A major manufacturer of wafer fabrication equipment, crucial for the precision manufacturing needed for 3D stacking
Amkor Technology: A semiconductor packaging company with expertise in 3D stacking techniques